The Ivy Bridge CPU architecture, based on the 22nm manufacturing process, has the market mostly covered by now.
That means the Core Series, Celeron and Pentium chips based on the Sandy Bridge architecture have to go.
According to our findings, Intel has more or less digested its inventories of such processors, so it makes sense to remove them from its product lists altogether.
It won’t all happen at once, but the roadmap does seem to suggest that the Santa Clara, California-based company isn’t wasting any time tying up these loose ends.
The Sandy Bridge-based 32nm Pentium G870, G645 and G645T, for example, will be out of the picture by the end of the year (2012). The same goes for the Celeron G555, G550 and G550T CPUs.
The Pentium G440, Core i7-2700K, Core i5-3450, Core i5-2310 and Core i3-2105 won’t be gone quite so far, but shops and PC makers won’t be able to order them anymore from January onwards.
On the desktop front, Sandy Bridge will linger for a while longer. Currently, it accounts for 60% of all shipments, while Ivy Bridge covers 34%. Atom and Sandy Bridge-E have 4% and 2%, respectively.
In the first half of 2013, Pentium and Celeron Ivy Bridge CPUs will finally debut, as will Haswell. This will change the face of the market. Haswell will only manage 4%, but Ivy Bridge will account for 75-78% of Intel’s CPU sales.
Haswell will only do better in the third and fourth quarters of 2013, when its market share will reach 20%. Sandy Bridge will only keep 4% by that point.
Intel has successfully ported the ARM-friendly Android Jelly Bean (4.1) to run on its mobile x86 architecture.
At this stage, porting Google’s popular OS is a necessity for Intel, as Android is natively coded for RISC-based devices powered by ARM chips, rather than x86 processors.
Before the above-mentioned port was complete, Intel tablets and smartphones were primarily limited to Android 2.3 or 4.0.
Although the port is official, Santa Clara has yet to confirm when the updated OS will roll out to the few Intel handsets on the market.
It seems likely that the x86-friendly version of Jelly Bean will be pre-loaded on the UK-version of Motorola’s RAZR M smartphone which is widely expected to launch on September 18th.
ARM architecture has long been the leader in the smartphone market. Santa Clara, while dominant in the PC world, has yet to make much headway in the lucrative segment.
“We estimate Intel has been able to capture only 6 percent to 8 percent of market share in the mobile handset processor revenue business – with its small success in this area mostly due to the company’s acquisition of the wireless business of Germany’s Infineon Technologies,” IHS iSuppli analyst Craig Stice explained in a recent analysis.
Indeed, Santa Clara still hasn’t launched a smartphone in the US, limiting “Intel-inside” handset roll outs to France, the UK, India and China.
The top three performing CPUs are replacing the Core i7-3720QM, i7-3820QM and i7-3920XM Extreme models that have been just launched in April of this year.
The new models are reportedly called Core i7-3740QM, i7-3840QM and Core i7-3940XM Extreme and come with higher working frequencies and different prices.
On the low end, Intel comes with two “new” Sandy Bridge based Celerons, but you can find all the necessary information in the table below.
Though not precisely in official capacity, a few of the rumors we have reported and speculated on recently, concerning Intel’s processor plans, have been confirmed.
For one, last week we mentioned how the Haswell-EP processors were scheduled for release in 2014, allowing Sandy Bridge-E a longer market life.
Secondly, we learned that a Sandy Bridge-E SKU was in the making, called Core i7- 3970X, but we did not have all relevant info on it and could only guess at when it would be available.
The folks at VR-Zone are the people responsible for clarifying most things concerning these two matters, having published a roadmap slide.
The Core i7-3970X, being a Sandy Bridge E with 6 cores, will have 12 threads, a clock speed of 3.5 GHz, a Turbo Boost frequency of 4 GHz and a cache memory of 15 MB.
It is compatible with the LGA 2011 socket (X79 motherboards, present and future) and needs 150W of energy to work. Its release is set for the fourth quarter of this year (2012).
All in all, it is essentially a stronger incarnation of the Core i7-3960X, which comes with 3.3 GHz / 3.4 GHz Turbo performance, albeit lower energy requirements (130W).
There is one last thing we need to talk about here, and that is the Core i5-3350P CPU, based on the Ivy Bridge architecture.
It will have the integrated GPU disabled but more than decent computing prowess, with its 4 cores, 4 threads (no Hyper-Threading), 3.1 GHz frequency, 3.3 GHz Turbo Boost overclocking and 6 MB of L3 cache.
Intel’s chip will be compatible with socket LGA 1155 mainboards and will need 69W of energy.
It is interesting to see that Intel’s roadmap labels the Core i5-3350P as a Q4 2013 product. Due to fiscal/calendar year incongruity, however, fourth quarter doesn’t mean the same period of time for everyone.
Long story short, it is most likely that, like the Sandy Bridge-E, the i5-3350P will be released late in the third quarter of 2012.
When Intel first unveiled its grand plans for Ultrabooks at last year’s Computex, many of the fireworks were consciously reserved for Ivy Bridge-based variants in 2012 — well, they’re here. This year’s show in Taipei will show off the third generation of the skinny, MacBook Air-inspired platform, and Intel is toughening up the design requirements in the process. The thickness requirements are the same as last year, at 18mm for systems with screens under 14 inches and 21mm for bigger machines, but high-speed ports are now mandatory to get that coveted “Ultrabook” label and the full marketing weight of Intel’s $300 million Ultrabook Fund: if a PC doesn’t have either USB 3.0 or Thunderbolt, it’s out of the running. Intel also wants security built-in, rather than optional, as well as guarantees that a system is quick and responsive when it’s fully awake. Not that this would be terribly hard with the low-voltage Ivy Bridge processors launching at the same time, mind you.
Just to reinforce the importance of it all, Intel is noting that the flood of Ultrabooks is about to pick up in a big way as the category hits the mainstream. We were promised 75 Ivy Bridge Ultrabooks this year in a presentation back at CES; that number’s now up to 110, 30 of which will be Windows 8-friendly touchscreen models and another 10 opting for the convertible tablet route. At least some of those lightweight portables should pop up at Computex next week, and you can be sure we’ll be investigating as many of them as we can to see just how well Intel’s partners have advanced the game.
Normally, the input/output operations are managed by a different chip, but Intel chose to build the I/O directly into the main processor. This feature is called Intel Integrated I/O (Intel IIO).
What’s more, the I/O has unhindered access to the CPU cache, dramatically improving latency and data flow, thanks to Intel Data Direct I/O (Intel DDIO).
Things are made even better by how even PCI Express 3.0 is supported.
Overall, latency is reduced by up to 30% compared to previous-generation chips, and the PCI Express 3.0 triples the movement of data in and out of the CPU.
On a related note, Intel announced the Ethernet Controller X540 alongside the new Xeon, for cheaper, mainstream 10 Gigabit Ethernet implementation.
Low-cost, low-power LAN on motherboard (LOM) should soon include this single-chip 10GBASE-T solution, along with flexible I/O Virtualization and Unified networking.
Intel, the Santa Clara, California-based maker of central processing units, has decided to expand its collection of processors by unveiling some models for the Core i5 and Celeron series.
The new CPUs that Intel has released aren’t really the ones that knowledgeable customers have been waiting for.
As such, it is unclear what chances the newcomers have of selling well before the Ivy Bridge series makes its official debut.
Then again, dual-core next-generation chips aren’t going to appear until May and, even factoring in all other core counts, there will only be a few so-called flagships available at first.
That said, the new processors on Intel’s price list are Celeron B815, B720, 867 and 797 (for notebooks) and the desktop Core i5-2550K, i5-2450P and i5-2380P.
Celeron 867 (dual-core, two threads) and 797 (single-core, one thread) are ULV chips (ultra-low voltage) with clock speeds of 1.3 GHz and 1.4 GHz, respectively.
In that order, their prices are of $134 and $107, which translate into 101.41 and 80.8 Euro.
Meanwhile, the Celeron B815 and B720 sell for $86 and $70, respectively (65/53 Euro).
The former is a dual-core (two threads) unit with 2MB L3 cache and 1.6 GHz frequency, while the latter is a single-core, 1.7 GHz CPU (one thread) with 1 MB L3 cache.
Moving on, the Core i5-2450P and i5-2380P are priced at $195/148 Euro and $177/134 Euro, while the Core i5-2550K, the strongest of all the newcomers, sells for $225 (170 Euro).
The i5-2450P and i5-2380P have four cores each, four threads and 6MB of L3 cache memory, plus a TDP of 95W. What sets them apart is, predictably enough, the frequency: 3.2 GHz vs. 3.1 GHz.
Finally, the Core i5-2550K has most things in common with its two siblings above, only the operational clock is of 3.4 GHz. In other words, it is a somewhat stronger alternative to the Core i5-2500K (3.3 GHz), albeit costlier too ($234/177 Euro).
Selama ini Intel tidak menonjol di pasar smartphone, tapi itu bisa saja segera berubah. Intel baru-baru ini mengumumkan bahwa pihaknya telah mencapai kesepakatan dengan Inside Secure di mana mereka akan memasok chip dengan teknologi NFC untuk produk Intel yang akan datang.
”Kami sangat tertarik dengan teknologi NFC namun kami tidak akan mengumumkan rencana produk kami saat ini,” kata seorang juru bicara Intel kepada The Wall Street Journal. Walaupun terkesan menutupi namun kemungkinan Intel akan memasukkan teknologi NFC untuk semua produk Intel di masa mendatang.
Google Wallet muncul sebagai salah satu sistem pembayaran mobile pertama berbasis NFC, dan akan mulai digunakan di Amerika Serikat, tapi itu hanya tersedia di satu perangkat saja yaitu Nexus S, dan saat ini hanya didukung oleh Sprint. Verizon Wireless, T-Mobile dan AT&T telah berinvestasi dalam sebuah inisiatif bersama yang disebut ISIS yang masih dalam tahap pengujian sekarang, meskipun CEO Communications Verizon Lowell McAdam mengatakan ISIS akan memulai peluncuran yang signifikan di tahun mendatang.
Intel and Micron have debuted a 128 gigabit (Gb), multilevel-cell (MLC) chip.
The new 20nm monolithic 128Gb NAND is the first in the industry to enable a terabit (Tb) of data storage in a fingertip-size package by using just eight die.
The device provides twice the storage capacity and performance of existing 20nm 64Gb NAND, all while achieving speeds of 333 megatransfers per second (MT/s).
The new NAND is slated for use in next-gen tablets, smartphones and high-capacity solid-state drives (SSDs.)
Micron VP Glen Hawk noted the above-mentioned 20nm process technology employs a new cell structure that enables more aggressive cell scaling compared to conventional architectures.
Indeed, the 20nm NAND exploits a planar cell structure to overcome the inherent difficulties associated with advanced process technology – enabling performance and reliability on par with the previous generation.
Essentially, says Hawk, the planar cell structure successfully breaks the scaling constraints of the standard NAND floating gate cell by integrating the first Hi-K/metal gate stack on NAND production.
Intel and Micron are currently kicking off a December production ramp of their 20nm 64Gb NAND flash product that will enable a rapid transition to the 128Gb device in 2012. Samples of the 128Gb device are expected to be available in January, closely followed by mass production in the first half of 2012.
With the desktop version of its Sandy Bridge-E processors out and about, Intel is now focusing its attention towards the server version of these chips, the Xeon E5, and has recently provided the press with a series of new details about these CPUs.
According to the Santa Clara chip maker, in synthetic benchmarks an eight-core Xeon E5 CPU running at 2.7GHz should be more than twice as powerful as an Xeon X5690 six-core chips that runs at 3.46GHz.
In real life scenarios, the performance difference between the two server parts won’t be as high, but Intel still promises a minimum speed increase of 30%, while in some applications the Xeon E5 could prove to be up to 70% faster than its predecessor.
From the information leaked until now (some of which was published by ComputerBase), we know that the Xeon E5 range will be split into more than one CPU lines for single as well as multi-socket systems.
Intel’s Xeon E5 chips will support between four and eight computing cores with TDPs ranging from 50W to 130W, and include all the technologies that come standard with the Sandy Bridge architecture such as support for the AVX instruction set.
Depending on the socket used, Xeon E3 processors can also pack a tri- or quad-channel memory controller, up to 20MB of Level 3 cache memory, 2 QPI links, 40 PCIe Gen3 lanes, and four DMI 2.0 lanes.
Intel is sampling this chips right now to a select number of cloud and HPC computer vendors, but mass availability isn’t expected to be reached until the first quarter of next year.
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